CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD

Publication Summary

Currently there is a technology available that consists of attaching chip components on the solder F side of a PC. board, and discrete components on the component side of the P.C. Board. (See U.S. patent numbers 4,139,881 and 4,164,778).

Country	United States
Language	English (United States)
Related Person(s)	(AUTHOR)  Torleiv Melkeraaen
Copyright	Motorola Inc. March 1983

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(fi> MOTOROLA Technlcal Developments Volume 3 March 1983

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD

By Torleiv Melkeraaen

STATEMENT OF PROBLEM

          Currently there is a technology available that consists of attaching chip components on the solder F side of a PC. board, and discrete components on the component side of the P.C. Board. (See U.S. patent numbers 4,139,881 and 4,164,778).

In order to remain competitive in the RF oscillator market, new channel element designs make use
. of a P.C. board as a header (base) of the package.

   The use of RF circuitry and components on the solder side of these P.C. boards is not recommend- ed because of lack of shielding and protection. Therefore, the RF circuitry and components must be placed on the component side of these P.C. boards.

Described below, are three current methods Of assembling P.C. boards using discrete and chip components.

(i' Motorola, Inc. 1983 1

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Volume 3 March 1983

TM\ MOTOROLA Technical Developments -i

METHOD 1

PRESENT FACTORY FLOW

Leaded Component Insertion From Top of Board, Chip Component Placement on Top of Board

VW

PCB TRACE ANALYZER HORTSlOPENS TESTING

i STOCKROOM

A

SCREEN SOLDER PASTE

+

CHIP COMPONENT PLACEMENT

1

INSPECT c INFRARED REFLOW SOLDER t

CLEAN

I

B

t CHIP COMPONENT PLACEMENT

INSPE:TION

     t INVERT BOARD t FLUX/INCLINED WAVE SOLDER

  b CLEAN t INVERT BOARD

i

DIP COMPONENT INSERTION t

AXIAL COMPONENT INSERTION

fl RADIAL COMPONENT INSERTION

+I FLUX/INCLINED WAVE SOLDER

cl CLEAN

+I HP3060 ATE BOARD TEST

BACK-ENti QUEUE

ALTERNATIVE (B) PREFERRED

to! Motorola, Inc. 1963 2

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m

MOTOROLA Technical Developments Volume 3 March 1983

METHOD 2 PRESENT FACTORY FLOW

Chip Components (Only) on Top and Bottom Board

VW i PCB TRACE ANALYZER SHORTS/OPENS TESTING c

STOCKROOM

A

         t SCREEN SOLDER PASTE I CHIP COMPONENT PLACEMENT

c INSPECTION

INFRARED REFLOW SOLDER 4

CLEAN

I INVERT BOARD

I B

-t CHIP COMPONENT PLACEMENT

    TV INSPECTION c INVERT BOARD t FLUX/INCLINED WAVE SOLDER

+

CLEAN

b CHIP COMPONENT PLACEMENT

4

INSPECTION

1

INVERT BOARD

I

SOLDER

FLUX/INCLINED WAVE

;

CL AN

HP3060 ATE HOARD TEST

b BACK-END QUEUE

ALTERNATIVE (B) PREFERRED

ix ) Motorola. inc. 1983

[This page contains 15 pictures or other non-text objects]

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:M MOTOROLA Technical Developments --~~_

Volume 3 March 1983

METHOD 3

PRESENT FACTORY FLOW

Leaded Component Insertion From Top of Board, Chip Component Placement on Top and Bottom of Board

PCB TRACE ANALYZER SHORTS/OPENS TESTING

STOCK)ROOM

SCREEN SO)LDER PASTE #

CHIP COMPONENT PLACEMENT

t INSPECT

#

REFLOW SOLDER

t CLEAN

t DIP COMPONENT INSERTION

AXIAL COMPOf!ENT INSERTION

RADIAL COMPOkENT INSERTION

INVER!BOARD

CHIP COMPON:NT PLACEMENT

t INSPECTION

INVER:BOARD

FLUXllNCLfNDEtD WAVE SOLDER

t CLEAN

t HP3060 ATE BOARD TEST

b B...

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