Disclosed is a method that loads nano-sized particles into a system’s coolant fluid. Benefits include a significant increase in the thermal conductivity of the fluid. This increased thermal conductivity of cooling fluid results in reduced resistance at the cold plate.

Background

Currently, the only way to reduce plate-to-fluid resistance in single phase liquid cooling of electronic component like a processor is to increase the fluid flow rate. However, this leads to increased power consumption, the need for a larger pump, and more noise and vibrations.

General Description

The disclosed method loads the coolant fluid used in a coolant system with nano-sized particles. This results in a significant increase in the thermal conductivity of the fluid. One example of such nano-fluid laden system is deionized water loaded with Copper nano-particles. Figure 1 shows the basic parts of a single phase liquid cooling loop in a computer box.
One of the most significant resistances in the liquid cooling of computer boxes is the resistance from the cold plate to the fluid. In general, this resistance is a function of flow rate though the cold plate, as well as the thermal properties (conductivity) of the fluid being used. It is important for the fluid to have maximum thermal conductivity. Recent studies have shown that the effective thermal conductivity of enhanced fluid can be almost 30% greater as compared to pure fluid....