Magnetic Bubble Memory Module With A Thin Media I/O Structure
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Del.icio.us| IP.com Number | IPCOM000066132D |
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| Dated | Jan 1, 1979 UTC | ||
| Size | 2 page(s) (39.9 KB) | ||
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Publication Summary
The chip input output (I/O) assembly components of a magnetic bubble module having a low noise level is shown in Figs. 1 and 2. The assembly contains a flexible plastic substrate 12 that has four equal areas 14 for external connections. A preferred material for the substrate 12 is a polyimide. The areas 14 have copper signal lines 16 which are in electrical connection to pins 18.| Country | United States |
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| Language | English (United States) |
| Related Person(s) |
(AUTHOR) Mathers, MR (AUTHOR) Sykes, R |
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Magnetic Bubble Memory Module With A Thin Media I/O Structure
The chip input output (I/O) assembly components of a magnetic bubble module having a low noise level is shown in Figs. 1 and 2. The assembly contains a flexible plastic substrate 12 that has four equal areas 14 for external connections. A preferred material for the substrate 12 is a polyimide. The areas 14 have copper signal lines 16 which are in electrical connection to pins 18.
The flexible substrate 12 has an opening 20 therein suitable for a bubble chip 22 on a ceramic substrate 24 to be positioned thereon. Copper signal lines 26 connect the chip 22 to lands 28. The lands 28 are electrically bonded to the lands 30 on the flexible substrate 12.
The x and y rotational coils (not shown) are wrapped around sections 32 and 34, respectively. The low noise level is a result of the signal path in areas 14 being outside of the x, y coils.
This type of chip I/O assembly may be used with either an open or a closed bias structure in a bubble module.
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