Activation of a Nonconductor with Calcium Magnesium Carbonate Prior to Electroless Copper Plating
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Del.icio.us| IP.com Number | IPCOM000071900D |
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| Dated | Apr 1, 1970 UTC | ||
| Size | 1 page(s) (11.4 KB) | ||
| Disclosed by |
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Publication Summary
This is a method to activate a nonconductor such as ceramic, glass or the like prior to electroless copper plating. The process employs five steps: 1. Clean the nonconductor substrate in an alkaline cleaner such as Pennsalt K-2, Oakite, or equivalent material utilizing ultrasonic agitation means. 2. Rinse the substrate well with deionized water and dry. 3. Abrasively blast the substrate in a uniform manner with calcium-magnesium carbonate such as Dolomite or comparable abrasive blasting material. 4. Shake off excessive abrasive and place the substrate directly into an electroless copper plating solution at about 125 degrees F. Copper should deposit uniformly in approximately 15 minute. 5.| Country | United States |
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| Language | English (United States) |
| Related Person(s) |
(AUTHOR) McBride, DG |
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Activation of a Nonconductor with Calcium Magnesium Carbonate Prior to Electroless Copper Plating
This is a method to activate a nonconductor such as ceramic, glass or the like prior to electroless copper plating. The process employs five steps: 1. Clean the nonconductor substrate in an alkaline cleaner such as Pennsalt K-2, Oakite, or equivalent
material utilizing ultrasonic agitation
means. 2. Rinse the substrate well with deionized water and dry. 3. Abrasively blast the substrate in a uniform manner with calcium-magnesium carbonate such
as Dolomite or comparable abrasive blasting
material. 4. Shake off excessive abrasive and place the substrate directly into an electroless copper
plating solution at about 125 degrees F. Copper should
deposit uniformly in approximately 15 minute. 5. Remove the substrate from the plating solution after a desired thickness accumulates, rinse
the substrate, and dry it.
The adhesion of the copper into the substrate can be improved by sintering the metal into the substrate at approximately 800 degrees C in a nitrogen atmosphere.
During this process of plating, the calcium-magnesium carbonate becomes imbedded in the substrate and creates the desired potential which causes the copper to plate out electrolessly.
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