Activation of a Nonconductor with a Gold Solution Prior to Electroless Plating
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Del.icio.us| IP.com Number | IPCOM000072571D |
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| Dated | Aug 1, 1970 UTC | ||
| Size | 1 page(s) (11.3 KB) | ||
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Publication Summary
This is a formulation of a gold activation solution and the process for application to nonconductors such as glass or ceramic prior to electroless plating. The gold solution, when baked on a nonconductor, activates the surface so that copper or nickel plates to the nonconductor electrolessly.| Country | United States |
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| Language | English (United States) |
| Related Person(s) |
(AUTHOR) McBride, DG (AUTHOR) Vlasak, GP |
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Activation of a Nonconductor with a Gold Solution Prior to Electroless Plating
This is a formulation of a gold activation solution and the process for application to nonconductors such as glass or ceramic prior to electroless plating. The gold solution, when baked on a nonconductor, activates the surface so that copper or nickel plates to the nonconductor electrolessly.
The formulation for the gold solution is as follows: 2.5 milliliters of a gold plating solution and 97.5 milliliters of methanol.
The process for activating the nonconductor with the solution is as follows: 1. Dip a clean nonconducting substrate into the gold solution and withdraw the substrate slowly at a rate of approximately five inches per minute. 2. Dry the substrate in air. 3. Bake the substrate either in an air atmosphere for approximately ten minutes at 500 degrees F or on a hot plate for approximately thirty minutes. 4. Permit the substrate to cool. 5. Place the cooled substrate directly into an electroless copper plating solution.
Substrates processed in this manner copper plate out evenly and have a shiny appearance. The adhesion characteristics are substantially improved over other methods of activating the nonconductors prior to electroless plating.
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