Preparing your results....
Loading...
Press Esc to dismiss this message
More Information close

Month of March 2003

Showing 31 - 40 of 326 results
<< < Page: 2 3 4 5 6 7 8 > >>

IPCOM000011946D 2003-Mar-26
Disclosed is a method for multiple code streams in the instruction length decoder queue (ILDQ). Benefits include improved performance.
IPCOM000011945D 2003-Mar-26
Disclosed is a method for real-time hardware compression for high-bandwidth signal capture. Benefits include improved functionality, improved performance, and improved application design flexibility.
IPCOM000011944D 2003-Mar-26
Disclosed is a method for a modular interface that accommodates high-speed test and adds thermal and scrambling capabilities. Benefits include improved functionality and an improved test environment.
IPCOM000011943D 2003-Mar-26
Disclosed is a method for embedded copper (Cu) wire in multicoated passive component. Benefits include improved reliability, improved performance, and improved support for future technology.
IPCOM000011942D 2003-Mar-26
Disclosed is a method for a die-down flip-chip ball grid array/flip-chip pin grid array (FCBGA/FCPGA) package with an embedded metal heat spreader as the package core. Benefits include improved thermal performance.
IPCOM000011941D 2003-Mar-26
Disclosed is a method for coaxial solder ball shielding to reduce signal transmission loss between a component and a board. Benefits include improved performance.
IPCOM000011940D 2003-Mar-26
Disclosed is a method for a low-coefficient of thermal expansion (CTE) metal core design using slanted slot arrays. Benefits include improved performance.
IPCOM000011939D 2003-Mar-26
Disclosed is a method that etches holes through the entire silicon (Si) wafer at the final stage of processing. Benefits include reducing stress generated during the sawing process.
IPCOM000011938D 2003-Mar-26
Disclosed is a method that uses an automated vision system with an ultraviolet lighting source to detect the presence or absence of flux on the back-side of the die surface. The system also detects the percentage of flux coverage on the back-side of the die surface. Benefits include real-time monitoring.
IPCOM000011937D 2003-Mar-26
Disclosed is a method that uses a self-contained vision system to detect the presence or absence of Thermal Interface Material (TIM) on the back surface of the die, and IHSA Lid Sealant Material on the surface of the substrate. Benefits include real-time feedback regarding the tested units.
Showing 31 - 40 of 326 results
<< < Page: 2 3 4 5 6 7 8 > >>