Month of March 2004

Current high performance server class disk drives used in the enterprise and workstation environment are all packaged in a standard 3.5" form factor. The devices currently available all require approximately 12-19 Watts of operational power. Recording technology has advanced to the point that the available capacity on...

Disclosed is a method for timing test hooks for testing dynamic phase tracking interpolator-based receivers. Benefits include improved functionality, improved performance, and improved reliability.

Disclosed is a method that uses eutectic solder die bumps on the bump-less substrate C4 interconnects. These bumps are printed solder die bumps, rather than plated for the current high lead die bump application. Benefits include eliminating the reflow process and the bump formation module.

Disclosed is a method that uses a logic analyzer interface (LAI) probe assembly, an LGA/LGA-like connector, and a separate mPGA pin header. Benefits include enhanced design performance.

Disclosed is a method for a land grid array (LGA) contact beam with two bending sections; the two sections are shaped like a horizontal "V". Benefits include reducing both handling damage and contact shorting.

Disclosed is a method that uses a heat sink with attached posts to stiffen a PCB under the CPU and socket. Benefits include eliminating the need for a backing plate under the PCB.

Disclosed is a method that embeds a heat spreader on a package's surface during the molding process. Benefits include improving thermal performance, assembly yield, and manufacturing throughput.

Disclosed is a method that helps prevent silicon die from slipping when paste die attach materials are used to attach two pieces of silicon that are not perfectly centered over one another.

Disclosed is a method for an automatic ergonomic desk. Benefits include improved functionality.

Disclosed is a method for a boat preciser with multiple precising pins. Benefits include improved functionality and improved performance.